Self aligned channel implant, elevated S/D process by gate electrode damascene

ABSTRACT

A method for creating a self-aligned channel implant with elevated source/drain areas. Forming a thin dielectric layer on top of a silicon substrate, a thick layer of oxide is deposited over this dielectric. An opening is exposed and etched through the layer of oxide, through the dielectric and into the underlying silicon substrate creating a shallow trench in the substrate. By performing the channel implant LDD implant, pocket implant, forming the gate spacers and electrode, removing the thick layer of oxide and forming the S/D regions a gate electrode has been created with elevated S/D regions. By forming the gate spacers, performing channel implant, forming the gate electrode, removing the thick layer of oxide and performing S/D implant a gate electrode has been created with elevated S/D regions and disposable spacers. By forming the gate spacers and the gate electrode, removing the thick layer of oxide and performing S/D implant a gate electrode has been created with elevated S/D regions and spacers where the gate poly protrudes above the spacers thus enhancing the formation of silicide.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention belongs to the field of semiconductor manufacturing, andmore specifically to a method for the implantation of a self-alignedchannel and elevated source/drain areas in the damascene process.

2. Description of the Prior Art

Self-alignment is a technique in which multiple regions on the wafer areformed using a single mask, thereby eliminating the alignment tolerancesthat are required by additional masks. As circuit sizes decrease, thisapproach finds more application. One of the areas where the technique ofself-alignment was used at a very early stage was the self-alignedsource and gate implant to the poly gate.

The present invention relates to the Damascene process that is used forthe formation of semiconductor devices. Damascene derives its name fromthe ancient art involving inlaying metal in ceramic or wood fordecorative purposes. In Very Large-Scale Integrated circuitapplications, the Damascene process refers to a similar structure.

The Damascene process has been demonstrated on a number of applications.The most commonly applied process is first metal or local interconnects.Some early Damascene structures have been achieved using Reactive IonEtching (RIE) but Chemical Mechanical Planarization (CMP) is usedexclusively today. Metal interconnects using Damascene of copper and ofaluminum is also being explored.

As transistor dimensions have decreased, the conventional contactstructures used began to limit device performance. It was, for instance,not possible to minimize the contact resistance if the contact hole wasalso of minimum size while problems with cleaning small contact holesalso became a concern. In addition, the area of the source/drain regionscould not be minimized because the contact hole had been aligned to thisregion using a separate masking step whereby extra area had to beallocated to accommodate misalignment. It was also practice to useseveral, small contact holes of identical size meaning that the fullwidth of the source/drain region was not available for the contactstructure. This resulted in the source/drain resistance beingproportionally larger than it would have been in a device having minimumwidth.

One of the alternate structures that have been employed in an effort toalleviate this problem is the formation of self-aligned silicides on thesource/drain regions. Where these silicides are formed at the same timeas the polycide structure, this approach is referred to as a salicideprocess. The entire source/drain region (of, for instance, a CMOSdevice) is contacted with a conductor film. This approach becomes evenmore attractive where such a film can be formed using a self-alignedprocess that does not entail any masking steps.

Although CMOS is now a dominant integrated circuit technology, it was inits initial phases considered to be only a runner up for the design ofMOS IC's. The CMOS design is based on the paring of complementary n- andp-channel transistors to form low-power IC's. CMOS technology has, overthe years, developed to the point where it now offers advantages ofsignificantly reduced power density and dissipation, as well as indevice/chip performance, reliability, circuit design and fabricationcost.

In advanced CMOS processes, the gate length is short enough that LightlyDoped Drain (LDD) structures must be used to minimize hot-electroneffect, especially if the devices are NMOS devices. A removable spacerLDD process has been explored that does not required the use of anymasks other than the two needed to selectively form the sources anddrains of the two transistor types.

Various techniques have been developed for forming the shallowsource/drain junctions that are needed for sub-micron CMOS devices. Onesuch approach uses As for the n-channel devices while BF₂ ⁺is used forthe p-channel devices. Another approach applies the formation of CoSi₂(before the formation of the source and the drain regions) by means ofheavy ion implantation. Yet another approach uses the creation ofso-called elevated source-drains. A thin (for instance 200 um.)epitaxial layer of silicon can be selectively deposited onto the exposedsource/drain areas of the MOS transistor, this following theimplantation of the lightly doped region of the LDD structure and theformation of the spacers. This process leads to the formation of heavilydoped, shallow source/drain regions. The source/drain junction depth isthis case is less than 0.2 um. The gate oxide that covers thesource/drain regions is usually etched away and re-grown following theimplant step required for the elevated regions.

The method by which components of an integrated circuit areinterconnected involves the fabrication of metal strips that run acrossthe oxide in the regions between the transistors, the field regions.However, these metal strips form the gates of parasitic MOS transistors,with the oxide beneath them forming a gate oxide and the diffusedregions acting as the source and drain regions. The threshhold voltageof these parasitic transistors must be kept higher than any possibleoperating voltage so that spurious channels will not be inadvertentlyformed between devices. Several methods have been used to raise thethreshold voltage. These methods involve increasing the field oxidethickness or raising the doping beneath the field oxide. The large oxidestep however presents problems of step coverage so that reduced oxidethickness is preferred. The doping under the field oxide must thereforebe increased. Emphasis is nevertheless still placed on making the fieldoxide seven to ten times thicker than the gate oxide, this heavy layerof oxide also reduces the parasitic capacitance between the interconnectrunner and the substrate. Normally, ion implantation is used to increasethe doping under the field oxide. This step is called the channel stepimplant. The combination of channel-step-implant with the thick oxidecan provide adequate isolation for oxide isolated bipolar IC's.

In the deep sub-quarter micron CMOS process, Prior Art uses a (super)steep channel profile in order to maintain good current drive and highimmunity against leakage current and voltage penetration. This approachhowever increases the CR delay time due to the incurred high source todrain capacitance. The increase of the CR delay time can be avoided ifthe implant is located directly below the transistor gate. The challengewhen combining salicide technology with source/drain implantation is toachieve a shallow junction for the sub-quarter micron CMOS process.Elevated source/drain regions maintain good resistivity characteristicsfor the salicide process while at the same time providing shallowsource/drain junctions. The critical step in applying gatephotolithography typically is the step of exposing the source/draingate, within the process of the present invention the requiredtolerances for this processing step can be relaxed since the size of thesource/drain gate electrode has been increased.

U.S. Pat. No. 5,434,093 (Chau et al.) shows a self-aligned channelimplant, elevated s/d process by gate electrode damascene. However, thispatent differs from the invention in the exact order of the LDD I/I.This patent is very close-to the invention.

U.S. Pat. No. 5,538,913 (Hong) Process for fabricating MOS transistorshaving full-overlap lightly doped drain structure-shows self-alignedchannel implant, (not elevated) s/d process by gate electrode damascene.This patent does not show the invention's trench into the substrate.This patent is extremely close to the invention.

U.S. Pat. No. 5,801,075 shows a self aligned channel implant, elevateds/d process by gate electrode damascene. However, this patent differsfrom the invention by not showing an angled LDD I/I.

U.S. Pat. No. 5,376,578(Hsu et al.) teaches a FET with raiseddiffusions. However, this reference differs from the invention.

U.S. Pat. No. 5,786,256(Gardner et al.) recites a damascene gateelectrode process. However, this reference differs from the invention inthe exact I/I steps.

SUMMARY OF THE INVENTION

It is an objective of the present invention to create elevatedsource/drain regions by etching into the underlying substrate therebymaintaining good resistivity characteristics for the salicide processwhile at the same time providing shallow source/drain regions.

It is another objective of the invention to provide a gate electrodestructure with disposable spacers thereby facilitating the implanting ofthe Lightly Doped Drain (LDD) and Source/Drain (S/D) regions.

It is another objective of the invention to provide a gate electrodestructure wherein the gate polysilicon is above the gate spacers therebyfacilitating the process of surface silicidation.

It is another objective of the invention to provide a method to create adeep channel implantation for CMOS devices to improve device speed andwithout mask alignment problems.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices while maintaininggood device electrical insulation characteristics.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices without increasingdevice CR delay time.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices wherein theimplantation is located directly beneath the device gate electrode.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices while maintainingshallow junction depth on the top surface of the source/drain regions.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices while maintaininglow sheet resistance in the silicon substrate.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices thereby makingalignment tolerances for the photo lithographic exposing and etching ofthe device gates less critical.

It is another objective of the present invention to provide a method tocreate a deep channel implantation for CMOS devices for the salicideprocess.

Under the first embodiment of the present invention, the presentinvention teaches forming a thin dielectric layer on top of the siliconsubstrate; a thick layer of oxide is deposited over this dielectric. Anopening is exposed and etched through the layer of oxide, through thethin dielectric layer and into the underlying silicon substrate. Thetrench that is formed in this way in the substrate is shallow, a thinoxide layer is formed on the bottom of this shallow trench in thesubstrate followed by the channel implant, LDD formation and a pocketimplant. Spacers are formed on the sidewalls of the trench, the thinlayer of oxide at the bottom of the trench is removed and replaced witha gate dielectric. The trench is filled and planarized to form the gateelectrode. The thick layer of oxide surrounding the trench together withthe thin dielectric layer on the surface of the silicon substrate areremoved followed by the final step of implanting the source and drainregions.

Under the second embodiment of the present invention, the presentinvention teaches forming a thin dielectric layer on top of the siliconsubstrate; a thick layer of oxide is deposited over this dielectric. Anopening is exposed and etched through the layer of oxide, through thethin dielectric layer and into the underlying silicon substrate. Thetrench that is formed in this way in the substrate is shallow, a thinoxide layer is formed on the bottom of this shallow trench in thesubstrate followed by the formation of the spacers on the sidewalls ofthe trench after which the channel implant is performed. The thin layerof oxide on the bottom of the trench is removed and replaced with a gatedielectric, the gate electrode is formed. The heavy layer of oxide andthe thin dielectric layer on the surface of the silicon substrate areremoved; the source and drain regions are implanted. Silicide is formedon top of the source and drain regions and on the top surface of thegate electrode. The spacers are removed from the gate electrode followedby the implantation of the LDD in the surface of the substrate where thespacers previously contacted this surface.

Under the third embodiment of the present invention, the presentinvention teaches forming a thin dielectric layer on top of the siliconsubstrate; a thick layer of oxide is deposited over this dielectric. Anopening is exposed and etched through the layer of oxide, through thethin dielectric layer and into the underlying silicon substrate. Thetrench that is formed in this way in the substrate can be deeper thatthe trench formed under the first and second embodiment of theinvention, a thin oxide layer is formed on the bottom of this trench inthe substrate followed by the channel implant. The third embodimentdiffers from the first embodiment in that no LDD and pocket implantoccurs at this time. Spacers are formed on the sidewalls of the trench,the thin layer of oxide is removed from the bottom of the trench, thegate dielectric is formed at the bottom of the trench followed by theformation of the gate electrode. The spacer formed on the sidewall ofthe trench is overetched so that the top surface of the spacer is lowerthan the top surface of the gate electrode. This enhances the formationof silicide later in the process. The S/D implant is performed, sincethe trench that has been etched into the surface of the siliconsubstrate is relatively deep, most of the S/D area is above the gatedielectric. Lateral diffusion of the implant will cause the implant toalso reach the regions under the gate electrode spacers, this lateraldiffusion takes the place of previous LDD implant. The formation ofsilicide will take place on the top surface of the gate electrode andthe regions of the surface of the silicon substrate above the S/Dregions.

The structures obtained under the three embodiments of the presentinvention are not identical. These structures however meet theobjectives of the present invention as highlighted above.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-section of the silicon substrate after thedeposition of the thin dielectric layer and the deposition of the heavylayer of oxide for the first, second and third embodiment of theinvention.

FIG. 2 shows a cross-section after formation of a trench under thefirst, second and third embodiment of the invention.

FIG. 3 shows a cross-section after formation of the oxide on the bottomof the trench and during the channel implant, LDD and pocket implantunder the first embodiment of the invention.

FIG. 4 shows a cross-section after the spacers, gate dielectric and gateelectrode have been formed under the first embodiment of the invention.

FIG. 5 shows a cross-section after the heavy layer of oxide and thedielectric layer have been removed and during the source/drain regionsimplant under the first embodiment of the invention.

The above sequence of FIGS. 1 through 5 presents the first embodiment ofthe present invention. FIGS. 6 through 9 show the second embodiment ofthe invention.

FIGS. 1 and 2 remain, for the second embodiment of the invention, asshown above under the first embodiment of the invention and apply to thesecond embodiment of the invention.

FIG. 6 shows a cross-section after the formation of the layer of oxideat the bottom of the trench, the formation of spacers and the formationof the gate dielectric at the bottom of the trench and during theimplantation of the channel under the second embodiment of theinvention.

FIG. 7 shows a cross-section after the removal of the layer of oxidefrom the bottom of the trench, the formation of the gate dielectric andthe formation of the gate electrode under the second embodiment of theinvention.

FIG. 8 shows a cross-section after the removal of the heavy layer ofoxide and the thin dielectric layer from the surface of the substrateand during the S/D implant under the second embodiment of the invention.

FIG. 9 shows a cross section after the silicide has been formed on topof the S/D regions, the spacers have been removed and during theformation of the LDD regions under the second embodiment of theinvention.

FIGS. 10 through 13 show the third embodiment of the present invention.

FIGS. 1 and 2 remain as shown above under the first and secondembodiment of the present invention and apply to the third embodiment ofthe invention.

FIG. 10 shows a cross-section after the formation of the layer of oxideat the bottom of the trench and the implant of the channel under thethird embodiment of the invention. It is to be noted that the depth ofthe penetration of the trench into the surface of the semiconductorsubstrate is significantly larger than the penetration created under thefirst and second embodiment of the invention.

FIG. 11 shows a cross-section after the gate spacers have been formed,the layer of dielectric has been removed from the bottom of the trench,the gate dielectric and the gate electrode have been formed under thethird embodiment of the invention.

FIG. 12 shows a cross-section after the removal of the heavy layer ofoxide and the thin dielectric layer from the surface of the substrateand after the S/D implant has been performed under the third embodimentof the invention.

FIG. 13 shows a cross section after the silicide has been formed on topof the S/D regions and on the top surface of the gate electrode underthe third embodiment of the invention under the third embodiment of theinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring now specifically to FIG. 1, there is shown a cross section ofthe silicon substrate 10, a thin layer 12 of oxide formed on top ofsubstrate 10 over which a layer 14 of silicon nitride is deposited. Thetwo layers 12 and 14 together form a dielectric 24, see FIG. 3. A thicklayers 16 of oxide is deposited on top of this dielectric layer.

For the deposition of the thin layer 12 of oxide, Low Pressure CVD isthe preferred deposition technology because of the high deposition ratesand the excellent film thickness uniformity.

The thin layer 12 of oxide is typically deposited to a thickness ofbetween 20 and 500 Angstrom. The method of deposition is furnace oxidedeposition or CVD oxide deposition. Layer 12 serves as a stress releasebetween the silicon substrate (10) and layer 14 of silicon nitride.

Layer 14 is an etch stop layer, it is typically deposited to a thicknessof between 50 and 500 Angstrom, used for layer 14 can be SiN orSiO_(x)N_(y). This layer can be deposited using a thermal or CVDdeposition process.

Layers 16 is a thick layer of oxide, it is typically deposited to athickness of between 200 and 3000 Angstrom. It is deposited by eitherCVD or SOG techniques.

FIG. 2 shows a cross section after the trench 22 patterning and etchinghas been completed. The trench is patterned and etched using a widenedpoly pattern, that is a pattern wide enough that electrode spacers andthe gate electrode can be accommodated in the trench. The wider gatemakes the silicidation easier since silicidation typically exhibits theline-width effect, that is increased junction leakage caused by thesilicide in the source/drain regions while, to form a silicide, asubstantial portion of the Si from the junction is consumed. Thisline-width effect becomes more of a problem as the line width of thedevice shrinks. The etch is an etch through the thick layer 16, throughdielectric 24 and into the substrate 10. The etch forms a small, shallowtrench 26 in the substrate 10.

The width of trench 22 is typically in excess of 0.15 um and isdetermined by the width of the gate electrode.

Typical separation between the source and the drain region of the gateelectrode is 0.2 um. This separation follows from a typical physicalgate length of 0.10 um and a spacer width of 0.05 um.

The shallow trench 26 is typically between 100 and 1500 Angstrom deep.

FIGS. 3, 4 and 5 show the first embodiment of the present invention.

FIG. 3 shows a cross section after the formation of a thin oxide layerat the bottom of the shallow trench 26. The channel implant 36 has beencompleted creating the channel stop area 34 under the thin oxide layer32. Also completed is the LDD 38 and the pocket implant. It is to benoted that the LDD implant 38 is performed under an angle, this angle ofthe implant provides an implant “shadow” whereby the LDD implant andionization 38 will affect only the extreme corners under the shallowtrench 26.

During the LDD implant, layers 16 (FIG. 3) shadows the implant 38. As aconsequence, only the areas under the corners of the bottom of thetrench 26 (areas 32, FIG. 4) will accept the LDD implant 38.

Hot-carrier effects cause unacceptable performance degradation in CMOSdevices that are built with conventional drain structures if theirchannel lengths are less than 2 um. To overcome this problem, LightlyDoped Drains (LDD) are used. The structures absorb some of the potentialinto the drain and thus reduce the maximum electric field E_(M). In theLDD structure, the drain is formed by two implants. One of these isself-aligned to the gate electrode, and the other is self-aligned to thegate electrode on which two oxide sidewall spacers will be formed. Thepurpose of the lighter dose is to form a lightly doped section of thedrain at the edge near the channel. The E_(M) is reduced by thisstructure because the voltage drop is shared by the drain and thechannel, this in contrast with a conventional drain structure in whichalmost all of the voltage drop occurs across the lightly doped channelregion.

Channel implant typically uses arsenic (As), antimony (Sb), boron,borofluoride (BF₂), indium (In), phosphorus (P).

Typical implant conditions are as follows:

P-well implant: boron. energy: 100 to 220 keV dose: 1e13 to 1e14atoms/cm² boron energy: 5 to 40 keV dose: 1e12 to 5e13 atoms/cm² indiumenergy: 50 to 250 kev dose: 1e12 to 1e14 atoms/cm² N-well implant: Penergy: 300 to 600 keV dose: 1e13 to 5e14 atoms/cm² P energy: 50 to 300keV dose: 1e12 to 5e13 atoms/cm² As energy: 50 to 200 kev dose: 1e12 to1e14 atoms/cm²

The channel implant typically penetrates between 0.02 and 1.5 um.

The LDD is typically performed as follows:

For NMOS: As energy 1 to 10 keV dose 1e14 to 1e16 atoms/cm² For PMOS:BF₂ energy 1 to 10 keV dose 1e14 to 5e15 atoms/cm²

The indicated pocket implant establishes a high punch through voltagethat results in a low off-state current. Typical operating conditionsfor the pocket implant are as follows:

For NMOS: In energy 50 to 250 keV dose 5e12 to 1e14 atoms/cm² For PMOS:As energy 50 to 250 keV dose 5e12 to 1e14 atoms/cm²

FIG. 4 shows the formation of the spacer 42, the removal of the oxidefrom the bottom of the trench, the formation of the gate dielectric 44and the gate electrode 46.

Typical operating conditions for these three steps are as follows:

Spacer 42 can be formed using thermal S_(i)N or by CVD S_(i)N or bythermal SiO_(x)N_(y) or by CVD SiO_(x)N_(y).

Gate dielectric 44 can be formed RTO oxide or by JVD oxide or by RTPS_(i)N or by RTP SiO_(x)N_(y) or by JVD T_(i)O₂ or by JVD TaO₂.

Gate electrode 46 can be formed by CVD and/or poly Si or SiGe.

Spacer 42 typically is between 250 and 1500 Angstrom thick wherebyforming the gate spacer comprises thermally growing of a thin layer ofoxide on the sidewalls of the trench pattern using a short dry-oxidationprocess whereupon a conformal CVD oxide film is deposited by decomposingTEOS at between 700 and 750 degrees C. followed by an anisotropic dryetch, thereby leaving the spacers on the sidewalls of the trenchpattern.

It is to be noted that the thin layer of oxide at the bottom of thetrench is removed only after the spacer has been formed resulting in theremaining presence of this oxide in the extreme corners 32 and underspacer 42. The gate dielectric 44 is formed after the spacers have beenformed and is therefore present on the bottom of the trench and betweenthe spacers.

The spacers have been etched with a slight overetch, the spacer heightis therefore slightly less than the height of the poly. For poly gate athickness of 2000 Angstrom and a deposited oxide film thickness ofapproximately 2200 Angstrom, spacer width of 1000 Angstrom are typicallyobtained.

FIG. 5 shows the final structure of the gate electrode within the firstembodiment of the present invention. The thick oxide layers 16 (FIG. 4)is etched away. This etch is patterned with a wet or diluted HF, BOE RIEprocess designed to produce a poly feature with vertical sidewalls. Thethin dielectric layer 24 (FIG. 4) is also removed.

The n⁻implant 52 is the LDD that is formed by the implantation 38 (FIG.3). This implant, also called the graded drain or tip implant, can becarried out with phosphorous to form the lightly doped region of the S/Dregions.

The source/drain implant 56 is performed as follows, this implant formsthe S/D regions 54, FIG. 5.

Conditions for implant 56 are as follows:

For n⁺/p⁺NMOS: As energy: 15 to 100 keV dose: 1e14 to 5e16 atoms/cm² Penergy: 10 to 100 keV dose: 1e16 to 5e16 atoms/cm²

Conditions for the doping are as follows:

For PMOS: B energy: 1 to 50 kev dose: 1e13 to 1e16 atoms/cm² BF2 energy:5 to 180 keV dose: 1e13 to 1e16 atoms/cm²

The n⁻region at this time is essentially self-aligned to the gateelectrode. After the n⁻implant, a high dose n⁺implant is performed witha high current implanter. Typically, arsenic is implanted at a dose ofabout 5×10¹⁵ atoms/cm² and at energies of 40-80 keV. This forms thelow-resistivity drain region 54, which is merged with a lightly doped nregion. Because the spacer serves as a mask for the As implant, theheavily doped n⁻region is self-aligned to the sidewall spacer edges andis thus offset from the gate edge. Since the edge of the n⁺regions isfurther away from the channel than would have been the case in theconventional drain structure, the depth of the heavily doped region ofthe drain can be made somewhat greater without adversely affecting thedevice operation. The increased junction depth lowers both the sheetresistance and the contact resistance of the drain.

At this point in the processing sequence the gate electrode structurewithin the first embodiment of the present invention is complete.Created has been a device with an elevated source/drain structure and agate with a self-aligned channel implant. The elevate source/drainstructure prevents the consumption of silicon during silicidation and istherefore a major advantage of the structure of the present invention.

FIGS. 6, 7, 8 and 9 show the second embodiment of the present invention.The processing steps as detailed under FIGS. 1 and 2 apply also thesecond embodiment of the present invention, it is assumed that theexplanations previously provided for FIG. 1 and FIG. 2 precede thefollowing explanations.

Referring now specifically to FIG. 6, there is shown a cross section ofthe trench 22 for the gate electrode, the formation of a thin layer 72of oxide at the bottom of the trench 22 that has been etched into thesilicon substrate 10, the completion of (deposition and etch) thespacers 64 and the implant 66 of channel stop.

Referring now to FIG. 7, there is shown a cross section of the formationof the gate dielectric 71 and the creation (deposition andetch/planarization) of gate electrode 74. The layer of oxide 72 (FIG. 6)has, prior to the formation of the gate electrode, been removed from thebottom of the trench between the spacers 64, the gate dielectric 71 hasbeen formed between the spacers 64 and overlying the bottom of thetrench. Corners 70 of the trench retain the (original) oxide deposition.

The gate dielectric is formed by thermal oxide or RTO oxide or ThermalSiN or thermal SiO_(x)N_(y) or by RTP S_(i)N or by RTP SiO_(x)N_(y) orby JVC oxide, SiN, TiO₂ or TaO₂.

Referring now to FIG. 8, there is shown a cross section of gateelectrode after the layer of thick oxide 16 (FIG. 7) has been removed,dielectric 24 (FIG. 7) has also been removed. S/D implant 78 hasimplanted the source/drain regions 76.

FIG. 9 shows a cross section of the gate electrode after the formationof silicided layers 82, the removal of spacers 64 (FIG. 8) and theimplant 84 of the lightly doped areas 86. It must be emphasized that thesecond embodiment of the invention results in having disposable spacers,an approach that greatly facilitates the LDD implant as will be clearfrom FIG. 9.

FIG. 9 shows the cross section of the completed gate electrode withinthe scope of the second embodiment of the present invention. The secondembodiment also results in a device with elevated source/drain regionswhile the channel implant has been achieved by means of a self-alignedchannel implant. The advantages of the construct of the first embodimentas previously highlighted equally apply to the second embodiment of thepresent invention.

Processing conditions for the steps of channel implant, the formation ofLDD areas and spacer and the formation of the gate dielectric are, underthe second embodiment of the invention, essentially the same as theconditions indicated for these processing steps under the firstembodiment of the invention.

FIGS. 10, 11, 12 and 13 show the third embodiment of the presentinvention. The processing steps as detailed under FIGS. 1 and 2 applyalso the third embodiment of the present invention, it is assumed thatthe explanations previously provided for FIG. 1 and FIG. 2 precede thefollowing explanations.

Processing conditions for the third embodiment will not be furtherdetailed in the following while it will be assumed that these conditionsare identical to the processing conditions as highlighted for a givenprocess under the first two embodiments of the invention.

Referring now specifically to FIG. 10, there is shown a cross section ofthe gate trench with a thin oxide layer 32 on the bottom of this trench.The channel implant 36 has been completed creating the channel stop area34 under the thin oxide layer 32.

FIG. 11 shows the formation of the spacer 42 on the sidewalls of thegate electrode and the formation of the gate electrode 46. Area 44 underthe gate electrode and where the gate electrode interfaces with thesilicon substrate is the gate dielectric. The corner areas 32 of thebottom of the trench remain in place as the previously deposited thinlayer of oxide.

It must be noted that the top of the gate spacers 42 have beenover-etched and, in so doing, been lowered in height to the point wherethe top of the spacers is lower than the top surface of the thick layerof oxide 42. This is important to note since this over-etching of thetop of the spacers 42 facilitates the formation of silicide at a laterstage in the process of the formation of the gate electrode. The topsurface of the gate poly is higher than the top of the gate spacers. Itmust further be noted that the trench that has been etched into thesurface of the substrate 10 is deeper than the trench etched under thefirst two embodiments of the invention.

FIG. 12 shows the S/D implant 56 forming the S/D regions 54. In theareas 41, under the thin oxide layers 32 and under the gate electrodespacers, LDD regions are formed by lateral diffusion of the S/D implant56 around and under the vertical surface of the thin layer 32 of oxide.This lateral diffusion replaces the previous step of forming the LDDregions.

FIG. 13 shows the formation 43 of silicide on the surface of the siliconsubstrate above the S/D regions in addition to the formation of silicideon the top surface of the gate electrode.

While the present invention has been described with reference toillustrative embodiments, this description is not to be construed in alimiting sense. Various modifications and combinations, as well as otherembodiments of the invention reference to the description. It istherefore intended that the appended claims encompass any suchmodifications or embodiments.

What is claimed is:
 1. A method of forming a semiconductor for use witha gate electrode damascene process, comprising: providing asemiconductor silicon substrate; forming a thin dielectric layer on topof said substrate; depositing a thick layer of oxide on top of said thindielectric layer; creating a trench pattern, said trench pattern topenetrate and go through said thick layer of oxide, furthermore topenetrate and go through said thin dielectric layer, furthermore topenetrate the surface of said silicon substrate to form a shallow trenchin said substrate, said trench pattern having sidewalls in addition tohaving a bottom surface, said bottom surface being bordered by corners;forming a thin layer of oxide at the bottom of said trench pattern;performing a channel implant in said silicon substrate, said channelimplant being self-aligned with said trench pattern, said channelimplant penetrating said substrate to a depth between about 0.02 and 1.5μm; forming Lightly Doped Drain (LDD) areas in said silicon substrate,said LDD areas being self-aligned with the corners of said bottomsurface of said trench pattern by an angle implantation; forming apocket implant in said silicon substrate, said pocket implant beingself-aligned with said trench pattern; forming spacers on the sidewallsof said trench pattern; removing said thin layer of oxide from thebottom of said trench pattern where said thin layer of oxide is notcovered by said spacers; forming a gate dielectric at the bottom of saidtrench pattern where said thin layer of oxide has been removed; forminga gate electrode in said trench pattern; removing said thick layer ofoxide from the top of said thin dielectric layer; removing said thindielectric layer from the top of said substrate; and performing sourceand drain implant in the surface of said silicon substrate, said sourceand drain implant to be substantially self-aligned with said spacers. 2.The method of claim 1 wherein said thin dielectric layer contains a thinlayer of oxide with said thin layer of oxide having a thickness withinthe range of between 20 and 500 Angstrom over which is deposited a layerof silicon nitride, said layer of silicon nitride having a thicknesswithin a range of between 50 and 500 Angstrom, said thin layer of oxidebeing a CVD oxide whereby said thin oxide serves as a stress releasebetween said silicon substrate and said layer of silicon nitride, saidlayer of silicon nitride being deposited using a CVD process, said layerof silicon nitride serving as an etch stop layer.
 3. The method of claim1 wherein said thick layer of oxide is a layer with a thickness within arange between 200 and 300 Angstrom, said thick layer of oxide beingdeposited using CVD or SOG techniques.
 4. The method of claim 1 whereinsaid creating a trench pattern is creating holes using an RIE etchprocess designed to create said holes with vertical sidewalls, whereby awidth of said holes equals a width of a to be created gate electrodeincreased by two times a spacer width, thereby allowing creation of aspacer surrounding said gate electrode, whereby furthermore said holesare etched through said thick oxide layer further etched through saiddielectric layer and further etched into the surface of said substrate,thereby forming a shallow trench in the surface of said substrate. 5.The method of claim 1 wherein said creating a trench pattern is creatingsaid shallow trench to be wide in excess of 0.15 μm whereby said shallowtrench has a depth in the silicon substrate within a range of between100 and 1500 Angstrom.
 6. The method of claim 1 whereby said thick layerof oxide is of a thickness such that the implantation applied for theformation of the Lightly Doped Drain areas is deflected by said thicklayer of oxide thereby not affecting the channel implant, said notaffecting said channel implant further being emphasized by the angle ofimplantation for formation of the LDD areas, whereby said LDD implanttakes place under the corners of the bottom of said trench pattern,whereby furthermore said LDD implant is self-aligned with said trenchpattern.
 7. The method of claim 1 wherein said thin layer of oxide iscreated at the bottom of said trench pattern thereby creating a surfacewhere a gate dielectric will be formed, whereby said thin layer of oxideat the bottom of said trench pattern is created by wet oxidation attemperatures within a range of between 800 and 1200 degrees C. for aboutbetween 2 and 4 hours thereby creating said thin layer of oxide within arange of between 0.8 and 1.0 um.
 8. The method of claim 1 wherein saidchannel implant is a step of forming a self-aligned punchthrough stopperinto said semiconductor substrate, said punchthrough stopper beingaligned with said trench pattern.
 9. The method of claim 1 whereby saidforming a spacer comprises thermally growing of said thin layer of oxideon the sidewalls of said trench pattern using a short dry-oxidationprocess whereupon a conformal CVD oxide film is deposited by decomposingTEOS at between 700 and 750 degrees C. followed by an anisotropic dryetch, thereby leaving said spacers on the sidewalls of said trenchpattern.
 10. The method of claim 1, said spacers being formed by aprocess including a substantially conformal deposition within saidtrench pattern of a spacer material selected from the group consistingof nitride, oxide, BSG, PSG and any combination thereof, and asubsequent, anisotropic etch of said spacer material.